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Highly pure copper-coated tungsten powders were successfully prepared in fixed quantities using electroless plating, via the addition of an appropriate amount of 2,2′-dipyridyl to the plating bath. The effect of 2,2′-dipyridyl on the plating Cu rate, microstructure and performance of the coated Cu layer was studied systematically. Changing the concentration of 2,2′-dipyridyl had significant effects...