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Self‐assembled poly(amide amine)‐copper (PAMAM/Cu) film on silicon was prepared and investigated by means of contact angle measurement, XPS and atomic force microscopy (AFM). The tribological properties were evaluated using a reciprocal ball‐on‐disc test rig and a lateral force microscope. Results of XPS show the existence of Cu(0) and PAMAM molecule on the surface of the film. Compared with the self‐assembled...