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Current methods for the formation of pre-solder bumps for flip chip attachment use stencil printing techniques with an appropriate solder paste. The continuing trend towards increasing miniaturisation and the associated decrease in size of solder resist opening, SRO is causing production difficulties in particular associated with achieving sufficient yields with the stencil printing process. Practical...
Electroplating Sn plays an important role in the lead-free age because of its excellent solderability and many other advantages. In this work, bright Sn was electroplated onto both C194 and FeNi42 alloys. The plating parameters, substrate effect, barrier layer effect and IMC formation were investigated through detailed microstructural characterization of the Sn films, barrier layers and cross-sections...
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