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Solder paste is the most important strategic bonding material used in the assembly of surface mount devices in electronic industries. Rheology of solder paste is the most important parameter which affects the paste printing process, the reflow soldering performance, and wherefore the resulting solders joint quality and reliability. A clear understanding of the complicated interactions among various...
Solder pastes are widely used as a principal bonding medium in the electronics industry. Many paste parameters, such as paste composition, printing stencil aperture and reflowing profile, influence the printing performance and the reflow process of solder pastes. In this paper, experiments are conducted to investigate the effect of filmogens and solvents on slump-in-heating resistance of Sn-3Ag-0...
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