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The reliability life of solder joints is a well-known key topic for the electronics industry. Board level temperature cycling test is most common test method and provide an approximate means of relating the results from these performance tests to the reliability solder attachments for the use environments and conditions of electronic assemblies. Recently, due to environmental debates, SnPb solder...
A diaphragm-type optical fiber pressure sensor, which has a sleeve for fiber insertion, is proposed, and its fundamental characteristics are demonstrated. The sleeve structure is fabricated by deep reactive ion etching (DRIE). The diaphragm with the sleeve is suitable for highly reliable and easy bonding between the sleeve and an optical fiber. The light intensity change by a Fabry-Perot interferometer...
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