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The reliability life of solder joints is a well-known key topic for the electronics industry. Board level temperature cycling test is most common test method and provide an approximate means of relating the results from these performance tests to the reliability solder attachments for the use environments and conditions of electronic assemblies. Recently, due to environmental debates, SnPb solder...
The ability to produce conductive copper tracks using ink-jet printing to allow the routine digital manufacture of patterned electrical interconnects is a long standing industry aim. In this study an approach to achieve this goal is investigated that uses an ink-jet printed self-assembled monolayer (SAM) coating as a molecular etch resist. To date, ink-jet printed SAMs on copper have not had sufficient...
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