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SnCu2-4Ni1-2 as a lead-free solder was prepared from both sulfate and chloride plating solutions by galvanostatic electrodeposition. Current-potential polarizations for both plating baths were obtained with their respective deposition rates measured. Characterizations including SEM, EDX, and XRD were carried out to obtain relevant materials properties.
Polycrystalline films of semiconducting Cu(In1-xGax)Se2 (CIGS) quaternary alloy, one of the promising materials for photovoltaic applications, have been prepared by means of chemical spray pyrolysis (CSP). Copper, Indium and Gallium metal chlorides and Selenourea are used as constituent elements to prepare spray solution. Single phase CIGS films with chalcopyrite structure have been successfully grown...
Reaction of indium (In) and silver (Ag) during the electroplating process of indium over thick silver layer was investigated. It is found that the plated In atoms reacts with Ag to form AgIn2 intermetallic compound at room temperature. Indium is commonly used in electronic industries to bond delicate devices due to its unique ductility and low melting temperature. In this study, copper (Cu) substrates...
In this paper using an electroplating technique, an Ni/Cu structure was fabricated on multicrystalline n+Si solar cells to develop an inexpensive metallization method without the degradation of the cell performance. By the application of an ultrasonic system one can obtain a film with the lower surface roughness and the higher quality. The electrical resistivity of the electroplated Ni/Cu was investigated...
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