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Compact high density electronic equipment is achieved using the stacked via technology in a build-up substrate. In order to design the build-up substrate, the impact of the viscoelasticity behavior of insulating resin under heating and cooling must be considered. This paper investigates how to predict the stacked via fatigue life using a viscoelastic analysis. The thermal cycle test, elastic analysis...
In this study, Printed Wiring Board (PWB) specimens with Interstitial Via Hole (IVH) were exposed to thermal cycling test, and the thermal fatigue life scatter of IVH was investigated by Finite Element Analysis (FEA), taking into consideration the influence of interactions between different processes during manufacturing. Focusing on laminated structure of PWB, the FEA was conducted with detailed...
Developing the stress response using the molecular and mesoscale levels is fairly reliable during the initial strain. For instance, modulus is a property that can be established using these techniques and the continuity of scale suggests that both may be used to establish modulus for parameterizing a macroscale model when measured properties are unavailable. However, the latter part of the stress/strain...
For interconnection of liquid crystal display (LCD) driver IC, in this paper, thermosonic (TS) flip chip bonding technique which utilizes a lateral ultrasonic vibration as an additional heat source is considered. Larger amplitude of vibration produces more heat energy, which would accelerate the curing process of epoxy. In order to avoid potential problems due to large vibration amplitude such as...
This paper gives a review of acoustic and ultrasonic optical fiber sensors (OFSs). The review covers optical fiber sensing methods for detecting dynamic strain signals, including general sound and acoustic signals, high-frequency signals, i.e., ultrasonic/ultrasound, and other signals such as acoustic emissions, and impact induced dynamic strain. Several optical fiber sensing methods are included,...
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