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As the number of electronic components in automobiles increases, the electronic industry has seen an increasing demand for organic packaging materials that meet property requirements for long operations in harsh environments. One of the most challenging requirements for molding compounds for automotive electronics is high thermal stability. The plastic encapsulation material should survive continuous...
A water-soluble intermediate bi-functional compound with thioureido and carboxyl groups was prepared by reacting chitosan with ammonium thiocyanate and chloroacetic acid. The intermediate compound was then cross-linked by epichlorohydrin to prepare a novel water-insoluble cross-linked chitosan aiming to be used as an adsorbent for heavy metal wastewater treatment. Both the intermediate compound and...
Behavior of epoxy resin is critical for performance and reliability of electronic packages. The ability to predict properties of cross linked epoxy resin prior to laboratory synthesis will facilitate the materials design. Theoretical studies in this field face a big challenge because there is no conventional way to build atomistic models of specific polymers, which form a network. Molecular dynamics...
All synthetic organic plastics, it seems pretty safe to say, are to a greater or less degree electrical insulating materials or dielectrics, except when they have been deliberately modified by addition of conductive fillers. For the purposes of this review, therefore, the literature on plastics, even when not dealing specifically with electrical properties and electrical applications, is considered...
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