The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Recently, developing thick interfacial intermetallic compound layers with rough morphology has been detrimental to the long term solder joint reliability for lead free solders currently. A novel method has been developed to control the morphology and growth of intermetallic compound layers between pure Sn solder ball and Cu substrate by doping flux with amount of 2wt.% metallic Cu nanoparticles. And...
Sn-Ag-Cu solders have been widely used as lead-free candidates for the Ball-Grid-Array (BGA) interconnection in the microelectronic packaging industry. However, widely used Sn-Ag-Cu solders such as with 3.0–4.0 wt% Ag in microelectronics exhibit significantly poorer reliability than SnPb solder. For the improvement of the problem by SAC solder alloys, the IMC control at the interface are needed. In...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.