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Electromigration in the Ni/SnZn/Cu solder interconnect was studied with an average current density of 4.1times104A/cm2 for 168.5h at 150degC. When the electrons flowed from the Ni side to the Cu side, uniform layers of Ni5Zn21 and Cu5Zn8 were formed at the Ni/SnZn and Cu/SnZn interfaces. The results are similar to those without passage of an electric current. However, upon reversing the current direction...
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