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A bond pad failure mechanism of galvanic corrosion was studied. Analysis results showed that over-etch process, EKC and DI water over cleaning revealed more pitting with Cu seed due to galvanic corrosion. To control and eliminate galvanic corrosion, the etch recipe was optimized and etch time was reduced about 15% to prevent damaging the native oxide. EKC cleaning time was remaining unchanged in order...
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