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Pad finish is the direct interface between PCB and solder ball, it plays an important role in determining the compound and characteristics of IMC formed at those interfaces, and even to change the mechanical property and microstructure of bulk solder joint. In this paper, we investigated the reliability property of 10 different pad finish combinations. The substrate finish includes electro-plated...
The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a miniature joint specimen fabricated using micro solder balls. The influence of the size on crack initiation life is not remarkable, while the life which reaches complete failure reduces greatly when the ball size is decreased less than 150μm. The reduction in life is due to that the crack propagation...
The interrelation between a thermal cycle test and a mechanical shear fatigue test has been studied for CSP joints from the view point of fatigue life and the microstructural damage of solder joints. The fatigue lives in both methods are almost equivalent even though loading method is different. From the viewpoint of microstructure, the fact is attributed to that the transgranular failure is predominant...
Thermomechanical fatigue (TMF) resulted from the mismatch in the coefficient of thermal expansion (CTE) between solder and substrate would degrade the mechanical properties of solder joints during service. In this research, nano-structured polyhedral oligomeric silsesquioxane (POSS) reinforcing particles were incorporated into a promising lead-free solder, eutectic Sn-3.5Ag solder, by mechanically...
This paper presents the results of a thermal fatigue study of a 2512 ceramic chip resistor assembled with various Pb free solders including SnCu, SAC105, SAC205, SAC305, and SAC405. The test matrix also includes some limited evaluations with other variables such as cooling rate (solidification rate), thermal preconditioning and nitrogen (inert) reflow atmosphere. The matrix also includes a SnPb eutectic...
The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In...
The solder bump interconnection is originated by IBM in the early 1960s and Flip chip technology became popular in packaging. Comparing with conventional wire bonding interconnection package method, flip chip interconnection can offer excellent electrical performance, very small chip size packages and high input/output handling capability. Recently, organic substrates have replaced conventional ceramic...
For the last decades, many mechanical measurements on solder alloys were carried out. As a matter of fact, the microstructure of the solder materials is affected by their compositions. In addition, external variables like the reflow cooling rate, solder volume, thermal mass of the package and pad metallization may have an influence. For those reasons the discrepancies of creep measurements on solder...
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