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The interrelation between a thermal cycle test and a mechanical shear fatigue test has been studied for CSP joints from the view point of fatigue life and the microstructural damage of solder joints. The fatigue lives in both methods are almost equivalent even though loading method is different. From the viewpoint of microstructure, the fact is attributed to that the transgranular failure is predominant...
The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In...
For the last decades, many mechanical measurements on solder alloys were carried out. As a matter of fact, the microstructure of the solder materials is affected by their compositions. In addition, external variables like the reflow cooling rate, solder volume, thermal mass of the package and pad metallization may have an influence. For those reasons the discrepancies of creep measurements on solder...
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