The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Electrospun and fibers hydrogels are two focal points of research within the biomaterials community. The electrospinning process allows for fabrication of nanoscale, aligned topography and has been shown to direct cellular migration and outgrowth. Hydrogels exhibit benefits over traditional, rigid scaffolds in that they are injectable and can be tailored to mimic the mechanical properties of the surrounding...
We discuss the borehole deformation which is caused by the sensor and changes with time, and the ground stress formula calculated by the measured value is finally brought out, which is called stress measurement with rheological method. With the practical measurement, we use the nonlinear least squares method to get rock stress, and stress measurement with rheological method is similar to stress measurement...
Biocompatible polymeric hydrogels based on poly (vinyl acetate) (PVAc) and poly (methyl vinyl ether-co-maleic anhydride) (PMVE-MA) which demonstrated tunable adhesion to both hydrophobic and hydrophilic surfaces as ideal candidates for denture adhesives were prepared. PVAc was partially hydrolyzed in a mixed solvent of ethanol and water, and then mixed with PMVE-MA. Cross-linking between these two...
Electronic portable devices are aimed towards higher response speed with a better viewing resolution display. Nonconductive paste (NCP) and nonconductive film (NCF) are the adhesive materials used in fine-pitch display applications. This study compares two commercially available adhesives for fine-pitch chip-on-flex (COF) applications. The electrical performance of the NCP-bonded COF was better compared...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.