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Regarding the application of the chip on glass (COG) with anisotropic conductive film (ACF) to the liquid crystal displays (LCDs), the problems with the warpage of COG packages, interfacial delamination, and increasing contact resistance of bumps, during or after thermal and moisture loading, are major reliability issues encountered in the industry. The goal in this paper is to investigate the effect...
The temperature cycling performance of three different mold compounds is compared using a device known to experience interlayer dielectric cracking. The cumulative failure rate is represented well by a Weibull distribution. The distribution parameter is the same for the three mold compounds and stress ranges studied. The location of the failure rate curve with respect to the number of temperature...
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