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The electrically conductive adhesives (ECAs) are the emerging materials that can provide a lot of opportunities for the electronic manufacturing. They have much lower processing temperatures comparing to soldering, that reduces the heat impact on the components. Due to their properties they can be applied for interconnecting the temperature sensitive elements in the devices, for example in liquid-crystal...
Advanced wafer technology node has moved forward to 40 nm and below with an ultra low-K (ULK) dielectric constant value of 2.5. ULK shows lower mechanical strength and poor adhesion than that of low-K dielectric. Cu/ULK delamination becomes the major concern during the packaging reliability test. After eliminating the Cu/low-K delamination issue, experimental result shows that die crack become another...
As the main influencing factors for instability of film lines are widely used in microelectromechanical systems, buckle-driven delamination and electromigration of film lines on polymer substrate under electrical loading are reported in this letter. The critical buckling condition is obtained through Euler formula. In addition, postbuckling analysis for the film is derived to calculate the residual...
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