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This paper proposes a thermal network parameter estimation method to find RC parameters of the Cauer network using cooling curve of IGBT module. The solutions are developed by exploiting the relationship between thermal network parameters and time constants of junction temperature response curves. Experimental tests are performed to validate the accuracy of the developed method. Advantages of the...
The thermal performance of a flat-plate closed-loop pulsating heat pipe (PHP) is experimentally obtained. The PHP is manufactured by means of CNC-milling and vacuum brazing of a stainless steel 316L bottom plate and lid. Each channel of the PHP has a 2∗2 mm2 square cross section. In total 12 channels (6 turns) fit in the 50∗200 mm2 effective area of the PHP. During the experimental investigation,...
In power switch assemblies the heat is removed through laminate stacks containing thermal interface materials (TIM). Some information on a TIM layer quality can be obtained by dedicated thermal conductivity testers, but the in-situ behavior of a TIM in the assembly may significantly differ. Thermal transient testing yields partial thermal resistances of these layers in the stack and can provide temperature...
Packages of commercial Gallium-Nitride power semiconductors present increasingly small dimensions to enable low parasitic inductance, increasing the heat flux density of the package and the challenges associated with their thermal management. This paper compares between Printed Circuit Boards and Direct Copper Bonded as substrates for a Gallium Nitride based half-bridge from a thermal and reliability...
This paper provides detailed analytical modeling and finite elements method (FEM) analysis of the thermal behavior of the medium frequency transformer (MFT). A comprehensive analytical model in form of a thermal network consisting of conduction, convection and radiation thermal resistances is generated based on the transformer physical structure, thus allowing for fast optimization of the MFT design...
This paper presents a new and low-cost thermal interface assembly between a printed circuit board and a heat-sink that provides electric isolation on the whole surface, and thermal conduction where needed. The assembly relies on the association of an isolation and a spacer layer and a thermo-conductive gel. The bill of material is 8 times lower than a best in class thermal pad, and equivalent thermal...
In this paper, we proposed a new small-sized power device. In the structure of the proposed device, the semiconductor chips are mounted vertically and both top and bottom surfaces of the device are cooled. By applying such a structure, it was shown that miniaturization can be realized without spoiling thermal characteristics. Furthermore, the thermal response characteristics of the proposed device...
Thermal architecture choice has a large impact on a products ultimate performance in thermally limited products. Thermal parameters interact, hence Design Of Experiments (DOE), which can include interaction effects, is the preferred explorative strategy. However, DOE has the drawback of potentially resulting in impractically large experimental arrays and correspondingly overly large datasets and large...
This paper discusses the problem offitting parameters of a detailed circuit thermal model when the complete data on problem geometry or material properties are not available. The problem is illustrated based on a practical example of a test hybrid circuit. Unknown model parameter values are determined here from dynamic temperature measurement results which were processed employing the Network Identification...
Air cooling motor in mini electric vehicle has high power density, internal heat sinking conditions are poor, thermal design and temperature control of the motor are put forward high requirement[1]. In this paper, the relationship between electromagnetic load and loss is deduced, the equivalent thermal network model of air cooling motor is constructed, and the regular of temperature rising distribution...
Power converter is going in the direction of the high power density. Aimed at the trend, a 1200V/300A planar double-side cooling IGBT module has been designed, packaged. Comparing with conventional IGBT module, Parasitic inductance is reduced by 43.26%; Thermal resistance is 26.7% lower; Turn-on time and turn-off time are decreased by 35% and 15.8% respectively; The total power losses are reduced...
In this paper, the principle of heat dissipation for power module of electric air conditioner is analyzed mathmatically, and the method of optimizing the heat dissipation structure is proposed. The thermal analysis model of the power module is built by the finite element method. Simulation results show that the proposed method can optimize the thermal performance of the power module, extend the life...
A conduction-cooled REBCO racetrack coil that is stored and impregnated in a stainless steel case is proposed for mechanical reinforcement of the straight parts. Two racetrack coils composed of a stack of four single pancakes wound with two kinds of the REBCO tapes were fabricated and tested using conventional and new advanced conduction cooling systems, respectively. As the latter a more simplified...
Using SMD packages with high power dissipation is challenging. To cool the SMD power packages, the state of the art solution is to use a PCB with thermal vias to extract the heat from the electronic package [1]. This solution has the disadvantage that the thermal resistance from package to heatsink is relatively high, in the range of 5–10 K/W. A new solution for cooling is proposed, in which the heatsink...
This paper describes a specific cooling system based on forced convection. The main purpose of the system is to evacuate the heat generated by power surface mount components like: high speed converters, high frequency clock synthesizers, linear circuits etc. During the study, the main heat transfer types as conductive and forced convection were described using a mathematical model of the system. Due...
An experimental study was conducted to examine the behavior of a refrigerant two-phase system for cooling multiple servers at differing vertical locations within a standard data center rack. In such racks, the vertically stacked servers may operate at different utilization levels and hence may have differing power dissipations. Furthermore, these distinct power dissipations may occur at differing...
The wide band-gap (WBG) semiconductor electronics such as silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular in power electronics applications due to their excellent functionality at higher operating temperatures, powers, frequencies and in high radiation environments compared to Si devices. However, the continued drive for higher device and packaging densities has led to extreme...
The Si micro-fluid cooler, combining micro-jet array impingement, micro-channel flow and micro-trench drainage, has been designed and experimentally evaluated. Enhanced jet array impingement has been achieved by eliminating the negative cross-flow effect among adjacent nozzles. Low thermal resistance
An entirely novel multilayer printed circuit board technology called EmPower allows embedding of chip components like power diodes, MOSFETs (Metal-oxide Semiconductor Field Effect Transistors) or IGBTs (Insulated Gate Bi-polar Transistors) at a significantly reduced module thickness into a glass fiber reinforced epoxy-resin layer built-up. One major concern is to handle the power loss within the given...
This work proposes an experimental microchannel solution to cool microelectronic chips with hot spots, using a non-intrusive technique. In microelectronics, approaches such as die thinning induces acute stress on cooling because it increases the hotspot phenomena and reduces chip bulk thickness aimed for microchannels. In mobile devices, the heat must be removed using limited pumping power and cooling...
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