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To ensure high reliability for advanced automotive electronics, investigation and understanding on the failure mechanisms under harsh conditions are needed. New methods and technologies for improved reliability and increased lifetime should be developed. In this paper, an investigation on the effect of high temperature aging on the thermomechanical properties, microstructure of the molding compounds...
In this paper, an investigation on the reliability issues of the packages for high temperature applications is presented. First, experimental characterizations of aging effect on the packaging materials and the package were carried out. DMA, TMA and TGA were used to measure the moduli, coefficients of thermal expansion (CTE), and the shrinkage induced by the aging process. Construction analysis was...
Additives to insulating oil and oil treatment by absorbents are investigated by thermal aging tests with the aim of suppressing flow electrification in power transformer insulation. 1, 2, 3-benzotriazol (BTA) is found to be effective for suppressing the increase of electrostatic charging tendency (ECT) in oils that contain either sulfide or sulfoxide compounds. Sulfide compounds are contained in new...
Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on...
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