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An analysis of thermal decomposition in oxidative conditions of model wood-based materials glued with amino resin. The presented work includes the results of thermal analysis of model samples of particleboards glued with urea-formaldehyde resin with varying degree of sealing (5 ÷ 30%), which is a measurable factor changing the elemental nitrogen content in the samples. Changes of the kinetic parameters...
A novel parameter of the relative rate of thermal decomposition has been defined on the basis of an analysis of equation relating the logarithm of the conversion degree on the temperature. The dependence of this parameter on temperature in the dynamic conditions has been analyzed and discussed. The dependence of the relative rate of thermal decomposition is a linear relationship involving two coefficients...
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