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This research work investigates the effect of 0.5 wt%, 1.0 wt% and 1.5 wt% Sb addition in 96.8 wt% Sn 2.5 wt% Ag 0.7 wt% Cu. Addition of Sb has shown significant effect on metallography, wettability (using ZnCl2 as flux), thermal properties as well as mechanical properties of the SnAgCu solder. The wettability test has been carried out using Cu as substrate by varying the solder temperature. A good...
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