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Power Electronic Module (PEM) design requires simultaneous analysis of thermal, electrical, and mechanical parameters to design an optimal layout. The current design process being used by package designers involves a sequential procedure instead of a simultaneous process. Each design step involves the analysis of the thermal, electrical or mechanical aspects of the design. As a result, the designer...
Multi-chip power module design requires simultaneous analysis of thermal, electrical, and mechanical parameters to design an optimal layout. The current design process being used by package designers involves a sequential procedure that is time-consuming and requires multiple design runs. The existing Power-CAD methodology that automates the module design process and optimizes the layout has been...
The objectives of this paper are (1) to develop a frequency planning methodology that maximizes the total performance of multi-core processors and that limits their maximum temperature as specified by the design constraints; and (2) to establish the implications of technology scaling on the performance limits of multi-core processors. Given the intricate designs and workloads of multi or many-core...
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