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Power on chip is highly temperature dependent in deep sub-micron VLSI. With increasing power density in modern 3D-IC and SiP, thermal induced reliability and performance issues such as leakage power and electromigration must be taken into consideration in the system level design. This paper presents a new methodology to accurately and efficiently predict power and temperature distribution for 3D ICs.
This paper describes a method of simulation of electrothermal issues during the design phase of smart power SOI ICs using a network simulator only and with no other special tools. The results permit a qualified look into the inner volume of power devices especially the active transistor silicon level with respect to the thermal conditions and allow the closest common simulation of circuitry and heat...
This paper discusses electromagnetic (EM) and thermal co-analysis for chip, package and board co-design and co-simulation. The limitation of classical divide-and-conquer approaches based on cascading techniques are investigated in reference to global methodologies where chip, package and board are simulated using one single model methodology. Cascade and single model methodologies are applied to a...
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