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A methodology is presented for simulating the dynamic electrothermal behavior of power electronic circuits and systems. In the approach described, the simulator simultaneously solves for the temperature distribution within the semiconductor devices, packages, and heat sinks (thermal network) along with the currents and voltages within the electrical network. The thermal network is then coupled to...
The authors compare two methods applied to 3D temperature map computation of power hybrid circuits. The first is the conventional FE method, and the second, so-called thermal influence coefficient method (TIC), is a specific procedure devised for fast temperature computations of hybrid power circuits. The numerical methods designed for true 3D thermal analyses have been implemented in programs running...
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