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Thermal analysis is crucial for determining the propagation of heat and tracking the formation of hot spots in advanced integrated circuit technologies. At the core of the thermal analysis for integrated circuits is the numerical solution of the heat equation. Prior academic thermal analysis tools typically compute temperature by applying finite difference methods on uniform grids with time integration...
In this article, we propose
2‐based finite element (FE) solver for transient thermal analysis of high‐performance integrated circuits (ICs).
2‐matrix is a special subclass of hierarchical matrix or
‐matrix, which was shown to provide a data‐sparse way to approximate the matrices and their inverses with almost linear space and time complexities. In this work, we show that
2‐based mathematical...
An electrical-thermal co-simulation is presented for analysis of integrated circuits. The co-simulation addresses a wide range of situations where strong interactions between electrical designs and thermal issues have to be properly accounted. The capability of the co-simulation is extended to deal with large-scale problems by incorporating a domain decomposition scheme, parallel computing, and an...
That the QFP components are applied successfully depends on its heat design and analysis. So, in tins paper, facing the application of encapsulation design and assembly, a three dimensional model based on temperature field and its simulation analysis is carried out by using the finite element method under different cooling condition and structure parameters, according to such problems for QFP as cooling...
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