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Thermal cycling is typical working environment of electronic chips due to electronic equipment power on-offs and thermal excursions. Accelerated thermal cycling is widely employed to strictly examine the electronic products for aerospace usage to simulate the actual thermal environment throughout the service life. In this study, the effect of thermal cycling to mechanical property of Sn-3.0Ag-0.5Cu...
Structural reliability issues attract more and more attentions with the rapid development of electronic packaging industry. As the most venerable part of electronic packaging structure, the mechanical reliability of solder joints is greatly relevant to the system reliability of electronic products. The mechanical properties of solder materials have to be reasonably evaluated if numerical simulations...
In the paper, the compression deformation behavior in lead-free solders were conducted on a MTS-809 material tester at the temperature range of 233–398 K with the strain rate in the range of 0.001–0.1 s−1 and the height reduction of 60%. The results show that the stress-strain curves of lead-free solder Sn3.0Ag0.5Cu are influenced by temperature softening and strain rate hardening effects. Based on...
Electronic components are soldered on to a Printed Circuit Board (PCB) to form an electronic assembly. Earlier all solders contained Lead (Pb), but environmental concerns with Pb have paved the way for development of lead-free solders to replace the commercial Tin-Lead (Sn-Pb) solders in electronic packaging systems. Majority of lead-free solders available exhibit poorer properties and higher surface...
The ferroelectric and piezoelectric properties of Sn4+ modified (Ba0.7Ca0.3)(Ti1−xSnx)O3, (with x = 0.000 to 0.100 in steps of 0.025) lead free electroceramics were investigated. With Sn4+ substitution, a structural phase transition from pure tetragonal to pseudo-cubic structure has been observed; which strongly influence the ferroelectric/ piezoelectric nature of the samples. At room temperature,...
Electronics subjected to shock and vibration may experience strain rates of 1–100 sec−1. High strain rate data is scarce for leadfree solders at strain rates in the range of 1–100 sec−1, typical of drop-impact, shock and vibration. A new experimental method has been developed to achieve constant strain rate in the neighborhood of 1 to 100 sec−1 during the entire deformation history. SAC105 and SAC305,...
The reliability of BGA packages is primarily affected by thermo-mechanical deformations in the assembly as a consequence of the CTE mismatch of the materials. Typical failure modes are low-cycle fatigue of second level solder joints or delamination of pads from the PCB.
In this paper we present a set of (Bi0.5Na0.5)TiO3-based lead-free ceramics which can provide large strain in response to an external electric field. An effective piezoelectric constant, Smax/Emax, as high as 830 pm/V, is obtained in optimized compositions under proper exciting conditions. This value is comparable to some soft PZT ceramics used in modern multilayer actuators. Electromechanical measurements...
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC)...
Present work deals with the development of a low cost, appreciably accurate precision electronic circuit for resistive sensor where measurement of the incremental resistance with high degree of accuracy is essential. A linear and sensitive active bridge circuit requiring only few components for its hardware implementation has been proposed for measuring very small resistance change due to change in...
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