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Equations for fast and exact calculation of a simple model for heat transfer from a bond wire to a cylindrical finite mold package including nonideal heat transfer from wire to mold are presented. These allow for a characterization of an arbitrary mold/bond wire combination. The real mold geometry is approximated using the mold model cylinder radius and the thermal contact conductance of the mold/bond...
The high-voltage electric power is generally transmitted by underground cables in urban. Considering about the high cost for underground cable, it is necessary for us to get accurately biggest ampacity of electric cables in order to insure the operation of cables in safe. It is relationship of heat transfer with cables and soil. The coefficient of thermal conductivity of soil has great influence on...
Cooling is important to keep the temperatures of the highly integrated silicon electronic devices and power devices e.g. power MOSFET, IGBT. Yamaguchi et al. have proposed a new scheme to cool down the devices by its own current named ldquoself-cooling devicerdquo, in which the cooling process uses Peltier effect. In the proposed scheme, we should use the materials that have high thermal conductivity,...
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