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As the importance of quality insurance and reliability is increasing electronic manufacturers apply more and more failure detection and analysis methods in and off the production line. The aim of this paper is to describe and compare the applicability of several up-to-date failure analysis methods. The discussed techniques are X-ray microstructure analysis, SAM (scanning acoustic microscopy), SEM...
The effects of delamination at the mold component/die interface during reliability testing are investigated using scanning acoustic microscopy (SAM), and electrical and physical analyses. The SAM results are correlated with electrical end point (EEP) tests and destructive physical analysis. The spread of delamination during temperature cycling of units is examined. It is demonstrated that scanning...
The application of frequency-modulated continuous waves (FMCW) to the scanning acoustic microscope (SAM) is described. The technique provides a convenient way of separating specimen topography from reflectivity while enjoying the advantages of pulse compression. Furthermore, the system will enable sophisticated signal processing to be carried out at audio frequencies.
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