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This paper mainly introduces the principle of scanning acoustic microscope (SAM). Cases on the pin delamination of the Plastic Encapsulated Microcircuits (PEMs) with different packages are analyzed based on SAM. Meanwhile, the scanning method for detecting pins delamination in PEMs was summarized. In this proposed method, the sample was scanned respectively by using scanning modes of A-scan, C-scan,...
Delamination is a common defect of the Plastic encapsulated microcircuits (PEMs). So, delamination analysis is an important item in Screening, DPA and failure analysis of PEMs. This paper studies the delamination of a buffer in thin shrink small outline package (TSSOP) by using a scanning acoustic microscope (SAM). By using scanning modes of A-scan, B-scan, C-scan and X-scan of the SAM and analysis...
Microvia interconnection technology, which mainly includes blind via and buried via, has been put forward to meet the trends of ldquofaster, lighter, reliablerdquo in electronic industry. The technology plays a crucial role in the development of low cost and high density printed circuit board (PCB). However, as the cost for raw materials, like copper, keeps increasing, one defect blind via will lead...
The effects of delamination at the mold component/die interface during reliability testing are investigated using scanning acoustic microscopy (SAM), and electrical and physical analyses. The SAM results are correlated with electrical end point (EEP) tests and destructive physical analysis. The spread of delamination during temperature cycling of units is examined. It is demonstrated that scanning...
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