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Power supply disturbance excited by simultaneous switching output (SSO) circuits or core circuits is a serious issue in a system-in-package (SIP), especially in 3D stacked die package, because much more I/O circuits and core circuits excited simultaneously in synchronized with clock edges than the case of single die package. Therefore, decoupling schemes in such SiP's must be carefully designed including...
Power integrity design is a critical issue in system-in-packages (SiP's). In particular, power supply disturbance excited by simultaneous switching output (SSO) noise, or core circuits is serious in a 3D stacked die packages. Therefore, decoupling schemes in such SiP's must be carefully designed to reduce the impedance of power distribution network (PDN) as low as possible up to high frequency range...
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