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An integrated analog chip tester has been designed. Since we need to test the analog voltage of analog devices, a kernel architecture based on single chip computer (MCU) and AD converter has been designed. In order to solve the possible blight to tester caused by the damaged chips. This paper presents a technology for isolating inside and outside bus, a technology for double power supplies and a technology...
BAE Systems, under contract to the US Air Force Research Labs, has been developing a 4Mb Non-Volatile Chalcogenide Random Access Memory (C-RAM??) optimized for the radiation environments encountered in spacecraft applications. C-RAM is a phase change memory with a unique combination of features that collectively provide a high-density, low-power, non-volatile memory solution that is radiation hardened...
This paper presents principles and results of dynamic testing of an SRAM-based FPGA using time- resolved fault injection with a pulsed laser. The synchronization setup and experimental procedure are detailed. Fault injection results obtained with a DES crypto-core application implemented on a Xilinx Virtex II are discussed.
This paper describes several methodologies based on a pulsed laser beam to reveal the architecture of a high integrated SDRAM, and the different classes of Single Event Effects that can occur due to cosmic radiations. At cell level, laser is used to reveal an important technological parameter: the lithography process. At memory array level, laser is a powerful tool to retrieve cell physical arrangements,...
This document presents a compilation of results from tests performed by iRoC Technologies on SER induced by alpha particles on SRAM memories for technology nodes from 180 nm to 65 nm. The aim of this study is to establish the variation of sensitivity with technology node for SEU and MCU, and to analyze the possible influence of different designs and technological parameters at a given technology node.
The purpose of TAFT fault tolerance studies conducted at CNES is to prepare the space community for the significant evolution linked to the usage of COTS components for developing spacecraft supercomputers. CNES has patented the DMT and DT2 fault-tolerant architectures with 'light' features. The development of a DMT/DT2 testbench based on a PowerPC7448 microprocessor from e2v is presented in this...
Technology scaling leads to burn-in phase out and increasing post-silicon test complexity, which increases in-the-field error rate due to both latent defects and actual errors. As a consequence, there is an increasing need for continuous on-line testing techniques to cope with hard errors in the field. Similarly, those techniques are needed for detecting soft errors in logic, whose error rate is expected...
This paper reviews recent experimental confirmations that the intrinsic radiation robustness of commercial CMOS technologies naturally improves with the down-scaling. When additionally using innovative design techniques, it becomes now possible to assure that performance and radiation-hardness are both met. An illustration is given with an original nano-power and radiation-hardened 8 Mb SRAM designed...
There have been many solutions to create a soft error immune SRAM cell. These solutions can be broken down into three categories: a) hardening, b) recovery, c) protection. Hardening techniques insert circuitry in an SRAM cell possibly duplicating the number of transistors. Recovery techniques insert current monitors in SRAMs to detect SEUs and they employ error correcting codes or redundancy to mitigate...
In deep submicron era, to prevent larger amount of SRAM from more frequently encountered overheating problems and react accordingly for each possible hotspots, multiple ideal run-time temperature sensors must be closely located and response rapidly to secure system reliability while maintaining core frequency. This paper presented a method to extract run-time temperature information from multiple...
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