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Interfacial reactions between Sn–20 wt.%In–2.8 wt.%Ag (Sn–20In–2.8Ag) Pb-free solder and Cu substrate at 250, 150, and 100 °C were investigated. A scallop-type η-Cu 6 Sn 5 phase layer and a planar ε-Cu 3 Sn phase layer formed at the interface at 250 °C. The indium content in the molten solder near the interface was increased with the formation of the η-Cu 6 Sn 5...
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