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This paper deals with a method for design and manufacturing of power electronic substrates. Thick conductive patterns are made by the additive deposition technique using thick copper conductor paste. Substrates with excellent thermal and electrical conductivity, high resistance to thermal cycling stress, high resolution of printed patterns and good mechanical properties are created by this manufacturing...
Recently as represented by smart phones and high-speed graphic processing, data processing late is becoming more faster and band width is increasing rapidly. As a result, the clock speed of logic LSI and the bit rate of memory IC are becoming faster and faster. Additionally, the frequency of wireless communication is becoming higher, from GHz to several decimal GHz. The Semiconductor for these applications...
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