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The temperature impact on the Ohmic contact to Gallium Nitride (GaN) device properties is investigated in the range of 25°C to 300°C by means of the Transmission Line Method (TLM) technique. This study is centered in two kinds of Ohmic contacts: Implanted N+ GaN and heterojunction AlGaN/GaN contacts. For N+ contact resistance behavior is explained in terms of the field-effect or thermionic field effect...
We demonstrated the intersubband absorption through silicon ion implantation and subsequent rapid thermal annealing in undoped InGaAs/AlAsSb coupled double quantum wells. The effective temperature region of carrier activation for the implanted silicon ions is about 470~600 °C. For the sample with a silicon implantation dose of 1e14 cm-2, we obtained an actual carrier density of ~ 7.5e13 cm-2 (~75%...
A hybrid molecular dynamics (MD)/kinetic Monte Carlo (KMC) model is developed for atomistic modeling of fluorine ion implantation and diffusion in AlGaN/GaN heterostructures. The MD simulation reveals the F distribution profiles and the corresponding defect profiles, and most importantly, the potential energies of fluorine ions in the III-nitride material system. Using the results from the MD simulation,...
We proposed As+ ion implantation on SiO2 passivation layer of AlGaN/GaN HEMTs to improve the forward and reverse electric characteristics of AlGaN/GaN HEMTs. SiO2 passivation layer which was applied in this work suppressed the electron hopping from gate to the surface states of gate-drain region so that the virtual gate formation was suppressed and the electric field concentration was terminated....
In this work, we studied the proton and arsenic ion implantation-induced intermixing in InGaAsP/InGaAs and InAlGaAs/InGaAs quantum wells. The results were compared and discussed based on the defect formation and evolution process under the different implantation conditions and QW barrier materials.
In this work we report AIGaN/GaN HEMTs with nonalloyed ohmic contacts by large angle ion implantation with a contact resistance to the channel of 0.2 Omegamm.
The heterojunction field effect transistor (HFET) is demonstrated for the first time in InAlAs/InGaAs/InAlGaAs/InP material system using molecular beam epitaxy (MBE). A tungsten gate selfaligned HFET structure was made by ion imitation and rapid thermal annealing. The 1.0 mu m self-aligned gate HFET exhibited room temperature transconductance of 490 mS/mm with cutoff frequency of 9 GHz.<<ETX>>
A planar emitter-down AlGaAs/GaAs heterojunction bipolar transistor (HBT) has been fabricated by a molecular beam epitaxy overgrowth of the n-GaAs collector on top of the base layer after the base layer was formed by beryllium implantation and rapid thermal annealing. The emitter down transistors fabricated by this process had DC current gains of 20, and ring oscillators gave a maximum switching speed...
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