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Differential signal via structures in multi-layer printed circuit boards (PCBs) and packages are studied using an equivalent coupled multi-conductor transmission-line model. Thus, easy-to-understand transmission-line concepts, such as mixed-mode characteristic impedances and propagation constants, can be used to characterize the performance of differential signal via structures in a signal path. The...
This paper proposes a systematic methodology to model the single-ended and differential pogo pin structures for the analysis of signal integrity (SI), especially the reflected noise. A measurement method is developed for de-embedding the specialized fixture in the characterization of the pogo pins. The simulation and modeling methodologies are verified by the favorable comparison with the measured...
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