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The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints under electrotensile load was characterized, in comparison with those under pure tensile load. Experimental results show that under electrotensile load the stress-strain and strain-time curves of joints exhibit three distinct stages, i.e., the fast deformation stage at the beginning of loading, linear deformation stage and...
The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints under electrotensile load was characterized, in comparison with those under pure tensile load. Experimental results show that under electrotensile load the stress-strain and strain-time curves of joints exhibit three distinct stages, i.e., the fast deformation stage at the beginning of loading, linear deformation stage and...
Solder joints are subjected to a complex combined loading condition of tensile and shear deformation. The fracture behavior of solder joints is different when it is subjected to pure-tensile, pure shear or varying combination of mixed-mode tension and shear loading combinations. The observed failure modes can vary from brittle intermetallic (IMC) layer failure to ductile bulk solder shear failure...
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