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By collecting the data from thermal cycling test of an lead-free BGA interconnection structure, using type-I interval censored data processing method and modified Emgelmaier fatigue life model, the cycles to failure of lead-free solder joint are predicted. The comparison between the results obtained by proposed methods and the life calculated by Matlab verifies the practicability and effectiveness...
With more reliability requirement increasing in the IC packaging for mobile product, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. In light of the long cycle time of thermal cycle testing, we investigated the mechanical fatigue test instead of thermal cycle testing for shortening test time. The 4-point cyclic bending test is considered...
Based on the theories of Back-Propagation (BP) Artificial Neural Networks (ANN) and Genetic Algorithm (GA), combining with multiple statistical analysis method, fatigue life prediction and technological parameter optimization of QFN solder joints were studied in this paper. Firstly, correlation coefficient matrix of the swatch was gained by factor analysis; taking length and width of the pad, stand-off...
PbSnAg solder was widely used in die attachment for high power chip packaging, and the thermal-mechanical reliability of PbSnAg solder layer is a key factor to evaluate the quality of high power devices packaging. Viscoplastic finite-element simulation methodologies were utilized to predict Pb92.5Sn5Ag2.5 solder joint reliability for die attachment under accelerated temperature cycling conditions...
In order to increase the fatigue life of chip resistor, it is necessary to optimize the shape of solder joints. Shape and fatigue life of chip resistor solder joint were predicted by using finite element analysis methods. Through changing the solder volume, four typical solder joint shape prediction were conducted, and three-dimensional mechanical model of fatigue life analysis was set up. The distribution...
In this paper, the fine pitch ball grid array (FBGA) assembly with lead free solder was tested under thermal cycling condition. Finite element modeling and simulation was conducted. The microstructure designs of via in pad of substrate and through hole (via) in PCB under the solder joint were simulated. The solder mask definition (SMD) and non-solder mask definition (NSMD) on PCB board side was also...
Many solder creep and fatigue models have been developed to predict the fatigue life of solder joints under low-cycle fatigue conditions. However, because of the diversity of leadfree solders, additional work has been performed to find out effects of alloying content, surface finish, thermal cycle conditions and microstructure. Based on creep properties, the solder joint creep strain and creep dissipation...
The mechanical bending test results, as well as the modeling and calculation data were presented in this study to characterize the solder joint reliability. Bending test was completed simply by loading a series of displacements on the FR-4 printed circuit board (PCB) with devices and solder joints in single direction. A special bending tester that can control displacement exactly by a cam system was...
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