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With the rapid development of high density packaging technology, signal integrity of packages has become a hot research field. The signal integrity related problems, including noises (Delay, Reflection, Crosstalk between different line, etc.), bus timing design and power integrity issues, may seriously affect the performance of whole electronic system and even cause this system fail to work. This...
Increase in the cost of printed circuit board (PCB) with the increase in layer count has led to the design of PCB stack-ups that have broadside coupled signals. Broadside coupling of signals in adjacent layers also leads to crosstalk that can be sometimes difficult to model and quantify in terms of its impact on receiver eye opening. The difficulty stems from the fact that in most boards, broadside...
Dual-striplines are gaining popularity in the high-density computer system designs to save printed circuit board (PCB) cost and achieve smaller form factor. However, broad-side near-end/far-end crosstalk (NEXT/FEXT) between dualstriplines is a major concern that potentially has a significant impact to the signal integrity. In this paper, the broadside coupling between two differential pairs, and a...
Crosstalk among vias is a critical problem in high-speed digital circuits, deteriorating signal quality and increasing jitter, especially when circuit density is high. Underlying mechanism of crosstalk among vias is investigated in this paper. Using a physics-based equivalent circuit model, crosstalk as a function of various geometrical parameters, including parallel plane pair thickness, layer count...
The existence of an optimum line aspect ratio that minimizes interconnect delay for a given configuration is demonstrated. We study the sensitivity of this ratio to several line configurations and technological variations. The variation of far-end crosstalk voltage is also investigated with respect to line aspect ratio.
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