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Interconnect opens are known to be one of the predominant defects in nanoscale technologies. Automatic test pattern generation for open faults is challenging, because of their rather unstable behavior and the numerous electrical parameters which need to be considered. Thus, most approaches try to avoid accurate modeling of all constraints like the influence of the aggressors on the open net and use...
Interconnect opens are known to be one of the predominant defects in nanoscale technologies. Generating tests to detect such defects is challenging due to the need to accurately determine the coupling capacitances between the open net and its aggressors and fix the state of these aggressors during test. Process variations cause deviations from assumed values of circuit parameters thus potentially...
Open defects such as interconnect opens are known to be one of the predominant defects in nanoscale technologies. Yet, test pattern generation for open defects is challenging because of the high number of parameters which need to be considered. Additionally, the assumed values of these parameters may vary due to process variations reducing fault coverage of a test set generated under this assumption...
Interconnect opens are known to be one of the predominant defects in nanoscale technologies. However, automatic test pattern generation for open faults is challenging, because of their rather unstable behaviour and the numerous electric parameters which need to be considered. Thus, most approaches try to avoid accurate modeling of all constraints and use simplified fault models in order to detect...
In this paper, we present a new technique to improve the reliability of H-tree SRAM memories. This technique deals with the SRAM power-bus monitoring by using built-in current sensor (BICS) circuits that detect abnormal current dissipation in the memory power-bus. This abnormal current is the result of a single-event upset (SEU) in the memory and it is generated during the inversion of the state of...
Transient faults have become increasingly observable in combinational logic. This is due to the weakening of some inherent protective mechanisms that logic traditionally holds against such flawed spurious events. One of the aforementioned mechanisms relates to the propagation of transient faults along sensitizable paths. Existing literature that relies on logic simulation under estimates the number...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
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