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This paper presents an investigation into the thermal behavior of a DC-DC converter integrated on the back side of a thin-film photovoltaic (PV) module. Analytical thermal models of the converter and the PV module are made and the results obtained from the models are compared to the results obtained by computational fluid dynamics (CFD) simulations.
As the power dissipated by advanced microelectronic devices continues to increase, the demand for reliability also increases. This increases the requirements on the thermal performance of every part of the system, including the heat sink. One of the objectives of this study is to examine the effect of shape of the heat sink fins on the thermal performance of the system. The pressure gradient from...
PoP, Package-on-Package, becomes more and more popular in IC packaging industry because it provides a practical solution to reduce the footprint and enables separate package test before stacking them. It is widely accepted at mobile devices, especially for logic (bottom) plus memory (top) application. Meanwhile there are several technical challenges such as top to bottom package connection problem...
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