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Summary form only given. The conventional wire bonding has employed gold and aluminum wires as interconnection material for decades. With the requirements for high speed, high power and fine pitch applications, copper is emerging as the alternative bonding wires to replace gold and aluminum. In principle, copper has relatively good electrical mechanical and thermal properties. However, copper is known...
A novel flip chip process is reported in which bare dies are thermosonically bonded to arrays of electroplated copper columns formed on a substrate. The new process is intended as a low-cost, lead-free chip-on-board (COB) interconnection method for high-frequency devices. A detailed study has been performed of the electroplating and thermosonic bonding techniques involved. It was found that oxygen...
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