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Threshold voltage shift is a major problem for UMOS device. This study explains how device performance can be affected by silicon defects (interstitial and Vacancy). Interstitial may be induced by epitaxy process or trench process. Interstitial enhances the dopant diffusion. In TCAD simulation interstitial distribution is different for different diffusion model and shows shift in the threshold voltage...
Understanding (and predicting!) the properties of electronic transport in aggressively scaled devices used in VLSI requires a significant departure from 'conventional' approaches used so far which have relied on extrapolations to smaller length scales of models based on bulk band-structure (often a simple 'effective mass') and semiclassical (Boltzmann) transport. In this talk I will discuss some unexpected...
We present a generic method for analyzing the effect of process variability in nanoscale circuits. The proposed framework uses kernel and a generic tail probability estimator to eliminate the need for a-priori density choice for the nature of circuit variation. This allows capturing the true nature of the circuit variation from a few random samples of its observed responses. The data-driven, non-parametric,...
Plasma-exposed Si surface related to Si recess in source/drain region was investigated in detail for various superposed bias configurations with frequencies of 13.56 MHz and 400 kHz. Two different bias powers were utilized by an inductively coupled plasma reactor (ICP). The surface layer (SL) and the interfacial layer between the SL and Si substrate (IL) were analyzed by spectroscopic ellipsometry...
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