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This paper presents a method, which helps to understand and control interactions between dissimilar materials in electronics packaging assemblies. The method consisting of thermodynamic and kinetic modeling combined with detailed microstructural analysis is introduced first. The method will then be demonstrated using three examples. First one is taken from an IC metallization level, and explains why...
Using direct-write approaches in photovoltaics for metallization and contact formation can significantly reduce the cost per watt of producing photovoltaic devices. Inks have been developed for various materials, such as Ag, Cu, Ni and Al, which can be used to inkjet print metallizations for various kinds of photovoltaic devices. Use of these inks results in metallization with resistivity close to...
Screen-printing is widely used today as the metallization technique for industrial solar cells. Due to the limitation of the process, screen-printed contacts have low aspect ratio and low line conductivity that lower the efficiency of the solar cells. To address this issue, we developed a two-layer metallization process that deposited copper (Cu) as current-carrying electrodes by light induced electroplating...
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