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3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. The polymer material as insulation material was fabricated by the spin-coating or spray-coating process. And the polymer insulation can relax some of the stress induced and makes the process more convenient compared with CVD. Therefore, it is the most cost effective technology for the wafer level...
This paper describe the effect of adding fillers into polymer for dielectric properties improvement. Two types of untreated phyllosilicate fillers which are MMT and FC selected to be used in order to strengthen HDPE, SIR and NR properties. The dielectric properties of three materials were observed from Tan Delta and breakdown strength. Based on the findings, the tested filler contribute a marginal...
Through silicon via (TSV) technology has been widely applied in CMOS image sensors (CIS). This paper reports the wetting behavior of polymer liquid in the TSV insulation process by spin coating. The O2 plasma treatment was used to increase the hydrophilicity of the substrate surface in order to reduce the adhesion between the polymer liquid and the via sidewall. This surface treatment was to ensure...
This paper presents a novel spray coating process for the forming of sidewall insulation of through silicon via (TSV) which was a challenging process in CMOS image sensor (CIS) packaging. In conventional way, silicon oxide by plasma enhanced chemical vapor deposition (PECVD) is chosen as insulation material. In this paper, one kind of phenolic aldehyde polymer is deposited on the sidewall of though...
Through silicon via (TSV) technology has been widely applied in CMOS image sensors (CIS). This paper reports the wetting behavior of polymer liquid in the TSV insulation process by spin coating. The O2 plasma treatment was used to increase the hydrophilicity of the substrate surface in order to reduce the adhesion between the polymer liquid and the via sidewall. This surface treatment was to ensure...
This paper presents a novel spray coating process for the forming of sidewall insulation of through silicon via (TSV) which was a challenging process in CMOS image sensor (CIS) packaging. In conventional way, silicon oxide by plasma enhanced chemical vapor deposition (PECVD) is chosen as insulation material. In this paper, one kind of phenolic aldehyde polymer is deposited on the sidewall of though...
3D packaging using through silicon via (TSV) technology is becoming important in the integrated circuit (IC) packaging industry. This paper reports the wetting behavior of polymer liquids in the insulation deposition process by spin coating. Two methods containing adding wetting agent into polymer liquid and coupling agent treatments to wafer surface were implemented to improve the wettability between...
For many years glass and porcelain have been the dominant insulation materials for our bushes, insulators and circuit breakers. Recently however, the situation has changed and we now see outdoor circuit breakers at very high voltages of the order of hundreds of kilovolts using polymeric insulation. The advantages of polymeric insulation have always been known but their tracking performance in highly...
In this paper we have investigated the accelerated ageing of seven different thin-film module types through the use of sequential damp heat (85??C/85% RH) tests. The module types [a-Si, tandem a-Si/a-Si micro-morph a-Si/??-Si, triple junction a-Si, CIS (x2) and CdTe] were selected to cover a range of thin-film devices, materials and construction types. Sequential damp heat tests for cumulative exposure...
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