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In this study, 0.05 wt.% of Ni-coated multi-walled carbon nanotubes (Ni-CNTs) were successfully introduced into the 95.8Sn-3.5Ag-0.7Cu solder using the powder metallurgy technique, to synthesize a new lead-free composite solder system. The samples were characterized in terms of their microstructural and mechanical properties. Microstructural analysis of the polished samples revealed uniformly distributed...
Lead free solders with Sn-Ag-Cu (SAC) alloy compositions are now widely used in the electronics industry. Further enhancement of SAC solders by small addition of a forth element is aimed to improve the solder mechanical properties and the solder joint properties at the intermetallic bond interfaces. The addition of Ce to SAC solder with an alloy composition of Sn.3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) shows...
A series of tensile tests of 95.5Sn4.0Ag0.5Cu under a wide range of temperatures and constant strain rates are conducted. Base on the test results, empirical equations for predicting tensile strength, elastic modulus and yield stress are fitted as the functions of temperature. From the data of tests, it is found that temperature and strain rate demonstrate crucial effects on tensile and creep properties...
Although there seems to be agreement that the SnAgCu-solder is the lead-free alloy of choice, the basic eutectic SnAgCu system does not fully satisfy the requirements of an alternative to the classic SnPb system. Therefore the question is, how the simple SnAgCu eutectic needs to be changed in order to achieve a higher mechanical performance of the solder. Changes include the increase or reduction...
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