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2010 International SoC Design Conference > 213 - 216
IEEE Microwave and Wireless Components Letters > 2007 > 17 > 12 > 828 - 830
IEEE Transactions on Advanced Packaging > 2005 > 28 > 1 > 71 - 78
2010 International SoC Design Conference > 213 - 216
IEEE Microwave and Wireless Components Letters > 2007 > 17 > 12 > 828 - 830
IEEE Transactions on Advanced Packaging > 2005 > 28 > 1 > 71 - 78