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In the present paper, in order to realize the functions equivalent to the functions of the spherical bearing which is frequently used in conventional spatial mechanisms, a polymeric manufactured hinge with Hytrel® (DUPONT Co., Ltd.)[1], which has excellent flexural fatigue resistance, have been proposed. Next, the shape and dimensions of the polymeric manufactured hinge having low stress values at...
It is general to evaluate strength of a structure by the strain and the stress obtained by using the finite element method. The strong shape can be derived for an over load when these evaluations are used. However, it is not an enough evaluation if it thinks from the viewpoint used in a mid/long term. In this paper, we propose the damage estimation algorithm which estimates the damage of the structure...
With large scale increases of the train speed, it is of great practical significance to develop a fatigue test stand for high-speed train's transmission system. 3-DOF (three degree-of-freedom) electro-hydraulic shaking table for high-speed train's transmission system fatigue test is designed and its three dimensional mathematical model is established in this paper. In addition, static analysis and...
The purpose of this paper is to compare the abilities of two kinds of solder joints (63Sn37Pb and 96.5Sn3.0Ag0.5Cu) to resist thermal fatigue, and to predict their thermal fatigue lives. First, ten 2D simplified models of PBGA (Plastic Ball Grid Array package) structure with different shape of solder joints, which are obtained from surface mount experiments, are established using finite element software...
In this study both finite element modeling and experimental techniques are employed to study the reliability of electronics components under random vibration loading conditions. A fatigue life estimation procedure, that would help analyst to make relatively accurate prediction of induced fatigue life, Finite Element model of the test vehicle is built using ANSYS software. The model is first validated...
This paper presents the high reliability design method for lead-free solder joints on chip components, and that is able to evaluate effect of soldering process for solder joint shape. Coupled analysis of structure analysis and flow analysis was proposed for replication of solder wetting and behavior of electric components at the same time. The analysis methods enable to evaluate complex mechanism...
To improve the fatigue life of a panel with grooves, the stress relief groove is added after machining the tangent round transition structure. The purpose of this method is to reduce the stress concentration at the edges of rounded transition structure in the present study. To confirm the effectiveness of the method, analyses were performed by using software for two-dimensional elastic problems based...
The engine can be called the heart of a car and the piston may be considered the most important part of an engine. The piston endures cyclic heat and mechanical loads during work. Heat load was the major factor to cause ablation and heat crack of the piston head, and mechanical load was easy to bring crack at piston pin seat. In this study, mechanical fatigue experiments for one type of piston are...
This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
In order to increase the fatigue life of chip resistor, it is necessary to optimize the shape of solder joints. Shape and fatigue life of chip resistor solder joint were predicted by using finite element analysis methods. Through changing the solder volume, four typical solder joint shape prediction were conducted, and three-dimensional mechanical model of fatigue life analysis was set up. The distribution...
This paper targets the reliability of electronics components, specially avionics and automotive electronic system, under random vibration conditions. A fatigue life estimation procedure is presented and each step of procedure is explained. Finite Element model of the test vehicle is built in ANSYS. The model is first validated by correlating the natural frequencies, mode shapes and transmissibility...
This paper presents the results from preliminary models comparing the mechanical performance of polymer cored BGA type interconnects with conventional solid solder BGA balls. The surface evolver was first used to predict the solder fillet shapes for use in the models. The mechanical behaviour of some candidate polymer spheres were also measured and the results of these measurements used to estimate...
This paper presents mining the worst case of thermal fatigue life of solder joints on chip components used in vehicle electronics. Typical 36 cases with various solder shapes were examined. Thermal fatigue life including not only the crack initiation but also crack propagation was evaluated by using the finite element method. Based upon the case study's results, it was found that when a crack propagates...
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