The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In recent years, Sn-Bi solders get much attention because low temperature bonding technique is possible to reduce warpage of package and stress at solder joining. However, few studies attempted to their reliability and knowledge of microstructure of the solder bump. In this study, we investigated the difference of inter-metallic compounds (IMCs) formation between Sn57wt%Bi solder (Sn-Bi eutectic solder)...
Development of surface acoustic wave (SAW) devices has been getting attention to achieve next fifth generation (5G) mobile communications. We had previously proposed a temperature compensated SAW substrate, LiTaO3 (LT: lithium tantalate)/ST-cut quartz (ST-quartz), with which directly combined piezoelectric single crystals using amorphous intermediate bonding (AIB) method. In this paper, we investigate...
In the present article, we report a breakthrough approach for the rapid growth of whole void-free and highly preferred orientation Cu6Sn5 IMC interconnects of 50 µm thick by the current driven bonding (CDB) interconnect method and the use of a single crystal seeding substrate. There was no grain boundaries within the Cu6Sn5 IMC interconnect and no voids at both interfaces, which is beneficial for...
We proposed a single crystal quartz direct bonding method utilizing amorphous SiO2 intermediated layers, which can improve heat resistance of the optical low pass filter (OLPF) by novel fabrication method. An amorphous SiO2 was deposited on the opposite sides of both infrared reflection and anti-reflection coated substrates to prepare the highly activated surfaces. The substrates were bonded at 200...
Preparation of lithium niobate thin-film on silicon is demonstrated. The process employed is composed of mechanical thinning of the lithium niobate and bonding by using laser irradiation to the face-to-face interface of the two materials. The process is performed in the ambient air while keeping the wafers at room temperature.
In this paper, a novel crystal component package based on silicon TSV interposer substrate is demonstrated by using 3D integration technologies. It is distinct from conventional crystal component using ceramic-based substrate. This crystal component with advanced silicon-based substrate shows great manufacturability to replace traditional fabrication approach. In addition, the SU-8 sealing bonding...
High overtone bulk acoustic resonators (HBAR) have been realized using the Smart Cuttrade technology to transfer a thin X-cut LiNbO3 layer onto an X-cut LiNbO3 substrate. When the bonding of the two wafers is performed, an additional rotation along the normal axis is set to generate mode conversion between the two acoustic shear waves electromechanically coupled in X-cut LiNbO3. This enables excitation...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.