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The decomposition, i.e., segmentation, of multilayer printed circuit board links into constitutive parts by means of network parameter representations is widely accepted. This work examines implications of this procedure regarding differential links. For the first time, the physics-based single-ended stripline port is generalized to model coupled striplines in the environment of multilayer PCBs. Notably,...
Crosstalk within cable bundles can degrade system performance. In systems that use shielded twisted-wire pairs, the crosstalk occurs primarily in the connector, where individual signal wires are not shielded or twisted. In many cases, the parameters which determine crosstalk within the connector are unknown, in part because the connector is closed and wires cannot be accessed. A methodology was developed...
The paper proposes a distribution network for Gbps data transmission over. The study is based on a real design made for data communications of an aerospace instrument. This type of transmissions presents problems based principally on crosstalk and attenuation, therefore a careful design of distribution network and an adjustment of terminal loads are very important. A frequency scaled prototype at...
In recently years, high speed digital circuit equipment and products with electrostatic discharge (ESD) issues have become crucial due to tighter rise time and smaller geometry spacing. A typical ESD trouble shooting case is discussed involving a personal computer system followed with plain analysis to confirm the ESD interference path in a complex system. Further analysis studies several printed...
Coupled transmission lines are experimentally characterized by using 4-port S-parameter measurements in a broad frequency band (up to 20 GHz). Test patterns are designed and fabricated by using a ball grid array (BGA) package process. Symmetrically coupled transmission lines are decoupled into two eigen modes that can be readily determined from the measured S-parameters. Then transmission line parameters...
To clarify the electromagnetic compatibility (EMC) problems that related to the interconnection in the integrated circuit (IC) chip, transmission characteristics and electromagnetic coupling between wirings in the specially designed model transmission lines in IC chip were investigated. At first, model transmission lines, designed on the bear chip with the size of 4800 mum square, were created as...
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