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The mechanics and mechanisms of fatigue crack propagation in approximately 500nm thick freestanding copper (Cu) films were evaluated at three stress ratios, R = 0.1, 0.5 and 0.8. The fatigue crack propagation rate (da/dN) versus the maximum stress intensity factor (K max ) exhibited coincident features in the high-K max region (K max ≥ 4.5 MPam 1/2 ) irrespective of...
The dominant mechanics and mechanisms of fatigue crack propagation in ca. 500nm thick free-standing copper films were evaluated at the submicron level using fatigue crack propagation experiments at three stress ratios, R=0.1, 0.5 and 0.8. Fatigue cracking initiated at the notch root and propagated stably under cyclic loading. The fatigue crack propagation rate (da/dN) vs. stress intensity factor range...
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